Skip to Main Content
免費試用

Technical Paper

Fostering Thermal Design Innovation using Chip-Package-System Analysis Techniques

This paper outlines the Ansys design flow to dissipate heat within electrical packages and PCB's.

SHARE THIS TECHNICAL PAPER

查看 Ansys 的服務與產品

立即聯絡我們

* = 必填欄位

感謝您聯絡我們！

We’re here to answer your questions and look forward to speaking with you. A member of our Ansys sales team will contact you shortly.

Footer Image